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论文类型：会议论文

发表时间：2010-06-26

收录刊物：EI、CPCI-S、Scopus

卷号：675-677

页面范围：1213-1216

关键字：mould copper plate; surface modified layer; W-Cu alloys; infiltration; bonding strength

摘要：In this paper, a new method named infiltration was applied to fabricate W-Cu surface modified layers of copper mould firstly in order to promote the life span of the continuous casting machine (CCM) mould. Our efforts concentrated on fabricating the W-Cu modified layers on the surface of mould copper plate by presintering and infiltration under inert gases. The W particle size and sintering temperature of W skeleton were adjusted to gain homogeneous microstructure of W-Cu modified layers. The results show that homogeneous microstructure of W-Cu modified layers can be obtained with the method of presintering and infiltration. For the excellent microstructure of W-Cu modified layers, the suitable tungsten particle size is 300 meshes and the optimal presintering temperature is about 1300 degrees C. W-Cu modified layers have good bonding strength with copper substrate.