点击次数：

论文类型：会议论文

发表时间：2017-01-01

收录刊物：EI、CPCI-S、Scopus

页面范围：1438-1441

关键字：soldering; IMC grain; orientation; temperature gradient; anisotropy; electron backscattering diffraction (EBSD)

摘要：The anisotropic behaviors of micro solder interconnects have been recognized as a crucial reliability concern due to the continuous trend of miniaturization in high-performance electronic devices. The hexagonal structure eta-Cu6Sn5 with highly anisotropic phase structure has considerable influence on its growth behavior during soldering and performance in service. In the present work, synchrotron radiation real-time imaging technology was used to in situ investigate the growth behavior of eta-Cu6Sn5 intermetallic compound (IMC) in Cu/Sn/Cu solder interconnects during soldering under temperature gradient. The microstructure of the Cu/Sn/Cu micro interconnects and the orientation of eta-Cu6Sn5 IMC grains after soldering were characterized. The electron backscattered diffraction (EBSD) analysis revealed that the eta-Cu6Sn5 grains showed a preferred orientation, with their [0001] direction being nearly parallel to the direction of temperature gradient. The results pave the way for controlling the orientation of the small number of interfacial IMC grains in three-dimensional (3D) packaging technology.