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论文类型：期刊论文

发表时间：2017-04-01

发表刊物：JOURNAL OF ELECTRONIC MATERIALS

收录刊物：SCIE、EI、Scopus

卷号：46

期号：4

页面范围：1931-1936

ISSN号：0361-5235

关键字：Soldering; thermomigration; interfacial reaction; intermetallic compound; Sn-9Zn; dissolution

摘要：Interfacial reactions in Ni/Sn/Ni and Ni/Sn-9Zn/Ni micro solder joints during thermomigration (TM) have been studied by reflowing solder joints on a hot plate. Asymmetrical growth and transformation of interfacial intermetallic compounds (IMCs) were clearly observed. The growth of the Ni3Sn4 IMC in the Ni/Sn/Ni solder joints was always fast at the cold end and relatively slow at the hot end. Only asymmetrical growth of the Ni5Zn21 IMC in the Ni/Sn-9Zn/Ni solder joints occurred at the beginning because Zn was the dominant TM species; however, asymmetrical transformation of the Ni5Zn21 IMC also occurred under the combined effect of Zn depletion and Ni dissolution and migration, resulting in formation of a thin tau-phase layer at the hot end and a thick tau-phase/Ni5Zn21/tau-phase sandwich structure at the cold end. TM of Ni and Zn atoms was identified towards the cold end, being responsible for the abnormal IMC evolution. Addition of Zn was found to slow the TM-induced IMC growth and Ni dissolution.