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论文类型：期刊论文

发表时间：2017-02-27

发表刊物：APPLIED PHYSICS LETTERS

收录刊物：SCIE、EI

卷号：110

期号：9

ISSN号：0003-6951

摘要：beta-Sn grain orientation and configuration are becoming crucial factors to dominate the lifetime of solder interconnects in three-dimensional integrated circuit packaging. In this paper, we found that a temperature gradient during solidification significantly dominated the orientation and configuration of the final beta-Sn grains in Cu/SnAgCu/Cu micro interconnects. Being different from the random orientations and growth fronts meeting or cyclic twin boundary forming near the center after homogeneous temperature bonding, the beta-Sn grains solidified under a certain temperature gradient were observed to follow a highly preferred orientation with their c-axis departing from the direction of temperature gradient by about 45 degrees-88 degrees. Meanwhile, these preferred oriented beta-Sn grains consisted of low angle grain boundary structures with misorientation in the range of 0 degrees-15 degrees. The mechanism was explained in terms of the anisotropy and directional growth of beta-Sn grains. The results pave the way for grain orientation control in 3D packaging technology. Published by AIP Publishing.