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论文类型：会议论文

发表时间：2018-01-01

收录刊物：CPCI-S

页面范围：391-395

关键字：multipie reflow; size effect; interface reaction; intermetallic compound

摘要：With the development of the miniaturization and the integration of electronic products, the size of solder joints have gradually decreased in the packaging process. In addition, micro solder joints often need to be reflowed during the process of package interconnection due to the development of packaging technology, which greatly reduces the reliability of the solder joints. In this study, Sn-0.7Cu solder balls with the diameter of 200 mu m, 500 mu m, and 800 mu m were employed to react with Cu substrates at 250 degrees C for 1 minute and reflowed 1 to 20 times. The size effect of the interface reaction at Sn-0.7Cu/Cu was analyzed in this study.The results show that as the number of reflow times rises, the thickness of IMC layer and the size of Cu6Sn5 grains becomes larger. After the 9th reflow, the growth rate of IMCs' thickness and Cu6Sn5 grains' average diameter at the interface under multiple reflow gradually decreased. Multiple reflow have little effect on IMC growth which produced by the large-sized solder balls, compared with the smaller-sized solder balls. The size effect of formation and evolution of the intermetallic compound (IMC) obviously under multiple reflow.