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论文类型：期刊论文

发表时间：2016-10-15

发表刊物：JOURNAL OF ALLOYS AND COMPOUNDS

收录刊物：SCIE、EI、Scopus

卷号：682

页面范围：1-6

ISSN号：0925-8388

关键字：Synchrotron radiation; Soldering; Thermomigration; Interfacial reaction; Grain orientation; Intermetallic compound

摘要：Synchrotron radiation real-time imaging technology was used to in situ study the interfacial reactions of Cu/Sne-Zn/Cu solder joints during reflow under a temperature gradient. It was clarified that both Zn and Cu atoms were driven to migrate towards the cold end by the temperature gradient, which enhanced the intermetallic compounds (IMCs) growth locally and the Cu consumption at the hot end. A Cu5Zn8 layer adhered to the hot end interface could drastically restrict the consumption of the neighboring Cu substrate till it spalled from the interface. Additionally, the crystallization of beta-Sn grains was observed to follow a highly preferred orientation with the c-axis of beta-Sn grains departing from the direction of temperature gradient by about 30 degrees-40 degrees. These peculiar phenomena may inspire future exploration of interfacial reaction and grain orientation control by temperature gradient in 3D IC packaging technology. (C) 2016 Elsevier B.V. All rights reserved.