点击次数：

论文类型：期刊论文

发表时间：2012-10-05

发表刊物：JOURNAL OF ALLOYS AND COMPOUNDS

收录刊物：SCIE、EI、Scopus

卷号：537

页面范围：286-290

ISSN号：0925-8388

关键字：Synchrotron radiation; Ag3Sn; Intermetallic compounds; Crystal structure; Competitive growth

摘要：The growth behavior of Ag3Sn intermetallic compound (IMC), forming in the Sn-3.5Ag/Cu soldering solidification process, was in situ investigated by the synchrotron radiation real-time imaging technology. Three Ag3Sn growth patterns were observed, i.e., linear, Y and X shape, which were primarily related to the crystal structure of Ag3Sn. The size of linear Ag3Sn was larger than those of other shapes. For each pattern, growth velocity of each direction was almost the same. Competitive growth of Ag3Sn was also found in the early stage of solidification process. Most of Ag3Sn were dissolved and only some of them could grow up to the end. (C) 2012 Elsevier B.V. All rights reserved.