Hits:
Date of Publication:2022-10-07
Journal:MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
Affiliation of Author(s):材料科学与工程学院
Volume:18
Issue:1
Page Number:42-45
ISSN No.:1369-8001
Pre One:New method of boron removal from silicon by electron beam injection
Next One:Microstructures and mechanical properties of low carbon shplate materials