Release Time:2016-08-09 Hits:
Disigner of the Invention: Yi Tan,董伟,姜大川,李国斌
Institution: 材料科学与工程学院
Application Date: 2009-11-19
Application Number: 200910220058.6
Authorization Date: 2012-08-01
Prev One:一种利用催化腐蚀技术切割晶体硅的方法
Next One:一种合金法从废浆料中回收si和sic的方法