Hits:
Disigner of the Invention:胡祖麒,刘艳娇,xufumin,李国斌,jiangdachuan,Yi Tan
Affilication of Author(s):材料科学与工程学院
Application Date:2008-04-30
Application Number:200810011266
Authorization Date:2011-02-02
Pre One:电子束定向凝固技术精炼镍基高温合金的方法
Next One:连续熔炼去除多晶硅中磷和硼的方法及装置