Hits:
Disigner of the Invention:王亮,Yi Tan,倪萍,lijiayan
Affilication of Author(s):材料科学与工程学院
Application Date:2016-03-08
Application Number:201610131620.8
Authorization Date:2018-01-09
Pre One:一种去除多晶硅中硬质点不溶物的方法
Next One:电子束定向凝固技术精炼镍基高温合金的方法