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A compact parallel dispensing machine of high-viscous adhesive based on electrostatic-induced mechanism

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Date of Publication:2024-11-22

Journal:Microsystem Technologies

ISSN No.:0946-7076

Key Words:Adhesives; Adhesives bonding; Bonding performance; Bonding process; Dispensing machines; Flexible probes; High viscous adhesives; High-viscous liquids; MEMS; MEMS (microelectromechanical system); Micro-dispensing; Probes; System products

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