A compact parallel dispensing machine of high-viscous adhesive based on electrostatic-induced mechanism
Release Time:2024-12-24 Hits:
Date of Publication: 2024-11-22
Journal: Microsystem Technologies
ISSN: 0946-7076
Key Words: Adhesives; Adhesives bonding; Bonding performance; Bonding process; Dispensing machines; Flexible probes; High viscous adhesives; High-viscous liquids; MEMS; MEMS (microelectromechanical system); Micro-dispensing; Probes; System products