Current position: Home >> Scientific Research >> Patents

调节微电铸电流密度提高铸层界面结合强度的方法

Hits:

First Author:duliqun

Disigner of the Invention:李永辉,张晓蕾,xuzheng,liujunshan,Chong Liu

Affilication of Author(s):机械工程学院

Application Number:CN102618893A

Authorization number:CN201210119354.9

Pre One:集成厚度可控绝缘层的非接触电导检测微芯片制作方法

Next One:一种用于椭偏仪精确定位测量的装置及方法
Recommended Ph.D.Supervisor Recommended MA Supervisor Institutional Repository Personal Page

Address: No.2 Linggong Road, Ganjingzi District, Dalian City, Liaoning Province, P.R.C., 116024

Click : times
  • MOBILE Version
    •
    Open time:..
    The Last Update Time:..

    Mobile phone sweep