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调节微电铸电流密度提高铸层界面结合强度的方法

Release Time:2022-10-19  Hits:

First Author: 杜立群

Disigner of the Invention: 李永辉,张晓蕾,徐征,刘军山,Chong Liu

Institution: 机械工程学院

Application Number: CN102618893A

Authorization Number: CN201210119354.9

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