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集成厚度可控绝缘层的非接触电导检测微芯片制作方法

Release Time:2022-10-19  Hits:

First Author: 刘军山

Disigner of the Invention: 徐飞,Chong Liu,徐征,杜立群,王立鼎

Institution: 机械工程学院

Application Number: CN102641759A

Authorization Number: CN201210132614.6

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