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集成厚度可控绝缘层的非接触电导检测微芯片制作方法

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First Author:liujunshan

Disigner of the Invention:徐飞,Chong Liu,xuzheng,duliqun,wangliding

Affilication of Author(s):机械工程学院

Application Number:CN102641759A

Authorization number:CN201210132614.6

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