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Indexed by:期刊论文

Date of Publication:2012-04-01

Journal:TRIBOLOGY LETTERS

Included Journals:SCIE、EI

Volume:46

Issue:1

Page Number:95-100

ISSN No.:1023-8883

Key Words:Non-ferrous alloys; Grinding; SEM; TEM; Wear mechanisms

Abstract:Damage-free subsurfaces of soft-brittle HgCdTe (MCT) single crystals were directly achieved after nanogrinding by a developed ultrafine diamond wheel. This is different from those of hard-brittle semiconductors, where there is usually a damaged layer found after mechanical machining. Two chips induced by nanogrinding with thicknesses varying from 23 to 27.1 nm attached on the ground MCT surface were observed, which is consistent well with a proposed model of chip thickness. Nanoscale material removal mechanism was investigated using high resolution transmission electron microscopy. Twins and nanocrystals were observed within the chips found.