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Strengthening and toughening by interface-mediated slip transfer reaction in nanotwinned copper

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Indexed by:期刊论文

Date of Publication:2009-04-01

Journal:SCRIPTA MATERIALIA

Included Journals:SCIE

Volume:60

Issue:7

Page Number:508-511

ISSN No.:1359-6462

Key Words:Molecular dynamics simulations; Nanotwinned copper; Plastic deformation; Strength; Ductility

Abstract:Molecular dynamics simulation of tensile deformation shows that the high strength of nanotwinned copper is initially the result of the twin boundary pinning effect on dislocation motion, and that interface-mediated slip transfer mechanisms operate in the later stages of deformation. These mechanisms include the complete transmission of screw dislocations across twin boundaries via Fleischer and Friedel-Escaig mechanisms, the incomplete transmission of non-screw dislocations and transinission-induced jog formation. These factors are effective at maintaining the material's high strength and good ductility. (C) 2008 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

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