Release Time:2019-03-09  Hits:

Indexed by: Journal Article

Date of Publication: 2009-04-01

Journal: SCRIPTA MATERIALIA

Included Journals: SCIE

Volume: 60

Issue: 7

Page Number: 508-511

ISSN: 1359-6462

Key Words: Molecular dynamics simulations; Nanotwinned copper; Plastic deformation; Strength; Ductility

Abstract: Molecular dynamics simulation of tensile deformation shows that the high strength of nanotwinned copper is initially the result of the twin boundary pinning effect on dislocation motion, and that interface-mediated slip transfer mechanisms operate in the later stages of deformation. These mechanisms include the complete transmission of screw dislocations across twin boundaries via Fleischer and Friedel-Escaig mechanisms, the incomplete transmission of non-screw dislocations and transinission-induced jog formation. These factors are effective at maintaining the material's high strength and good ductility. (C) 2008 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.