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Indexed by:期刊论文

Date of Publication:2009-01-26

Journal:PHYSICS LETTERS A

Included Journals:SCIE

Volume:373

Issue:5

Page Number:570-574

ISSN No.:0375-9601

Key Words:Nanocrystalline copper; Molecular dynamics simulation; Plastic deformation; Dislocation; Grain growth

Abstract:The plastic deformation of nanocrystalline copper subjected to tension has been studied using molecular dynamics simulation. The results show that, in the initial stage, the deformation is mainly boundary-mediated in small grains; while in the late stage, the deformation is accommodated by dislocations in large grains. It is also found that the stress-assisted grain growth occurs owing to atomic diffusion and grain boundary migration. These results are consistent with recent experimental observations. (c) 2008 Elsevier B.V. All rights reserved.