Hits:
First Author:王千星
Disigner of the Invention:张大帅,Honghua Zhao,夏溪岑,付予,柴刚强
Authorization Date:2020-03-12
Authorization number:ZL202020301663.8
Pre One:一种利用真空磁场复合预压的加固软土地基的方法
Next One:一种弧形夹持结构的光纤传感器支座