Release Time:2022-10-20 Hits:
First Author: 刘聪
Disigner of the Invention: Honghua Zhao,唐小微,魏焕卫
Application Number: CN109372034A
Authorization Number: CN201811121388.5
Prev One:一种利用真空磁场复合预压的加固软土地基的方法
Next One:一种真空/电渗/磁场/堆载联合预压加固软基的方法