Hits:
Indexed by:会议论文
Date of Publication:2016-01-01
Page Number:1003-1006
Pre One:STUDY ON PRECIPITATION AND DISSOLUTION OF INTERFACIAL CU6SN5 DURING THERMOMIGRATION
Next One:Growth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnects under temperature gradient
