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董伟
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Associate Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates
Patents
[1] 一种电子封装微焊点的制备方法
[2] 一种填充垂直通孔的方法及装置
[3] 一种制备3D打印用超细球形金属粉末的方法及装置
[4] 一种制备3D打印用超细球形高熔点金属粉末的方法与装置
[5] 一种高效制备金属球形超细粉体的装置及方法
[6] 一种高效制备超细球形金属粉末的方法及装置
[7] 真空感应熔炼去除硅粉中磷及金属杂质的方法及设备
[8] 一种微互连凸点制备方法及装置
[9] 一种制备单分散球形多孔β-TCP粒子的装置及方法
[10] 一种高效制备金属球形超细粉体的装置及方法
TOTAL 36 PIECE 1/4
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