Personal Information
Associate Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates
Paper Publications
- [1] 黄自德.许富民,郭素墨,董伟.2219铝合金再结晶行为研究[J],热加工工艺,2019,47(24):211-214
- [2] 董伟.李文畅,许富民,韩阳,张伟.单分散铁基Fe60Ni7.5Mo7.5P10C10B5金属玻璃球形粒子的制备及评价[J],材料工程,2018,46(10):30-36
- [3] Hu, Ying-yan.Han, Jian-jun,Li, Can,Ma, Bing-qian,Liu, Chao,Yue, Wen,Li, Jian-qiang,Dong, Wei.Preparation and characterization of monosized Cu-Sn spherical alloy particles by pulsated orifice ejection method[J],JOURNAL OF MATERIALS RESEARCH,2018,33(18):2835-2843
- [4] Zhong, Y..Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Wang, Y. P.,Ma, H. T.,Zhao, N.,Dong, W..In situ study on the effect of Cu5Zn8 intermetallic layer on the Cu-Ni cross interaction in Cu/Sn-9Zn/Ni interconnect under temperature gradient[J],MATERIALS CHEMISTRY AND PHYSICS,2018,216:130-135
- [5] 董伟.白兆丰,康世薇,许富民,韩阳,李文畅.脉冲微孔喷射法单分散球形微粒子的制备及其应用[J],材料工程,2018,46(2):142-151
- [6] Zhong, Yi.Ma, Haitao,Zhao, Ning,Dong, Wei,Wang, Yunpeng.Growth mechanism of Cu3Sn grains in the (111)Cu/Sn/Cu micro interconnects[A],2018:1748-1750
- [7] Zhong, Y..Zhao, N; Dong, W (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Qiao, Y. Y.,Wang, Y. P.,Ma, H. T.,Zhao, N.,Liu, C. Y.,Dong, W..Continuous epitaxial growth of extremely strong Cu6Sn5 textures at liquid-Sn/(111)Cu interface under temperature gradient[J],APPLIED PHYSICS LETTERS,2017,111(22)
- [8] Zhong, Yi.Zhao, N; Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Wong, Chingping,Huang, Mingliang,Yin, Luqiao,Zhao, Ning,Dong, Wei,Ma, Haitao.Coupling effect of thermomigration and cross-interaction on evolution of intermetallic compounds in Cu/Sn/Ni ultrafine interconnects undergoing TLP bonding[J],JOURNAL OF MATERIALS RESEARCH,2017,32(16):3128-3136
- [9] Zhao, N..Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China.; Wong, CP (reprint author), Georgia Inst Technol, Sch Mat Sci & Engn, Atlanta, GA 30332 USA..Huang, M. L.,Ma, H. T.,Wong, C. P.,Zhong, Y.,Dong, W..Formation of highly preferred orientation of beta-Sn grains in solidified Cu/SnAgCu/Cu micro interconnects under temperature gradient effect[J],APPLIED PHYSICS LETTERS,2017,110(9)
- [10] Zhong, Y..Zhao, N; Dong, W (reprint author), Dalian Univ Technol, Elect Packaging Mat Lab, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Ma, H. T.,Dong, W.,Huang, M. L.,Zhao, N..Retardation of thermomigration-induced Cu substrate consumption in Pb-free solder joints by Zn addition[J],JOURNAL OF ALLOYS AND COMPOUNDS,2017,695:1436-1443