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Associate Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates

Paper Publications

[1]黄自德, 许富民, 郭素墨, 董伟.2219铝合金再结晶行为研究[J],热加工工艺,2019,47(24):211-214
[2]董伟, 李文畅, 许富民, 韩阳, 张伟.单分散铁基Fe60Ni7.5Mo7.5P10C10B5金属玻璃球形粒子的制备及评价[J],材料工程,2018,46(10):30-36
[3]Hu, Ying-yan, Yue, Wen, Li, Jian-qiang, Dong, Wei, Can, Ma, Bing-qian, Liu, Chao, Han, Jian-jun.Preparation and characterization of monosized Cu-Sn spherical alloy particles by pulsated orifi...[J],JOURNAL OF MATERIALS RESEARCH,2018,33(18):2835-2843
[4]Zhong, Y., Zhao, N., Dong, W., Wang, Y. P., Ma, H. T., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..In situ study on the effect of Cu5Zn8 intermetallic layer on the Cu-Ni cross interaction in Cu/...[J],MATERIALS CHEMISTRY AND PHYSICS,2018,216:130-135
[5]董伟, 李文畅, 康世薇, 许富民, 韩阳, 白兆丰.脉冲微孔喷射法单分散球形微粒子的制备及其应用[J],材料工程,2018,46(2):142-151
[6]Zhong, Yi, Zhao, Ning, Dong, Wei, Wang, Yunpeng, Ma, Haitao.Growth mechanism of Cu3Sn grains in the (111)Cu/Sn/Cu micro interconnects[A],2018,1748-1750
[7]Zhong, Y., Zhao, N., Liu, C. Y., Dong, W., Qiao, Y. Y., Wang, Y. P., Ma, H. T., N, Dong, W (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Continuous epitaxial growth of extremely strong Cu6Sn5 textures at liquid-Sn/(111)Cu interface ...[J],APPLIED PHYSICS LETTERS,2017,111(22)
[8]Zhong, Yi, Zhao, Ning, Dong, Wei, Ma, Haitao, Huang, Mingliang, Yin, Luqiao, Wong, Chingping, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Coupling effect of thermomigration and cross-interaction on evolution of intermetallic compound...[J],JOURNAL OF MATERIALS RESEARCH,2017,32(16):3128-3136
[9]Zhao, N., Zhong, Y., Dong, W., Huang, M. L., Ma, H. T., Wong, C. P., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China., Wong, CP (reprint author), Georgia Inst Technol, Atlanta, GA 30332 USA..Formation of highly preferred orientation of beta-Sn grains in solidified Cu/SnAgCu/Cu micro in...[J],APPLIED PHYSICS LETTERS,2017,110(9)
[10]Zhong, Y., Zhao, N., Ma, H. T., Dong, W., Huang, M. L., N, Dong, W (reprint author), Dalian Univ Technol, Elect Packaging Mat Lab, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Retardation of thermomigration-induced Cu substrate consumption in Pb-free solder joints by Zn ...[J],JOURNAL OF ALLOYS AND COMPOUNDS,2017,695:1436-1443

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