大连理工大学主页平台管理系统董伟 Formation of highly preferred orientation of β-Sn grains in solidified Cu/SnAgCu/Cu micro interconnects under temperature gradient effect Home

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Formation of highly preferred orientation of β-Sn grains in solidified Cu/SnAgCu/Cu micro interconnects under temperature gradient effect

Release Time:2019-03-12 Hits:

Indexed by: Journal Article

Date of Publication: 2017-01-01

Journal: Applied Physics Letters

Volume: 110

Issue: 9

Page Number: 93504-

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