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Associate Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates

Paper Publications

[61]谭毅, 李鹏廷, 李佳艳, 侯振海, 张磊, 安广野, 姜大川.多晶硅冶金制造技术进展及产业化实践[A],2014,185-185
[62]Li, Yaqiong, Tan, Yi, Jiayan, Morita, Kazuki, Y (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Si purity control and separation from Si-Al alloy melt with Zn addition[J],JOURNAL OF ALLOYS AND COMPOUNDS,2014,611:267-272
[63]李佳艳, 贾朋军, 刘瑶, 李亚琼, 曹盼盼, 谭毅, Tan, Yi.合金精炼提纯过程中金属 Sn 的电解回收研究[J],功能材料,2014,45(19):19138-19142
[64]Wu, L., Wang, T. M., Li, J., Chen, H., Sun, J. B., Cao, Z. Q., TM (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Numerical simulation on direct chilled continuous casting process for preparing clad slab of al...[J],INTERNATIONAL JOURNAL OF CAST METALS RESEARCH,2014,27(4):242-249
[65]王兵, 施伟, 谭毅, 尤启凡, 李佳艳, Tan, Y.(tanyi@dlut.edu.cn).硅蒸镀法制备硬质碳毡表面SiC涂层组成及微观结构分析[J],功能材料,2014,45(13):13135-13139
[66]Li, Jiayan, Wang, Dengke, Yaqiong, Zhang, Lei, Tan, Yi, Jiang, Dachuan, Y (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Research of boron removal from polysilicon using CaO-Al2O3-SiO2-CaF2 slags[J],VACUUM,2014,103:33-37
[67]游小刚, 谭毅, 李佳艳, 石爽, 郭素霞, Li, J.-Y.(lijiayan@dlut.edu.cn).电子束注入对多孔硅吸杂效果的影响[J],功能材料,2014,45(8):8129-8133
[68]Li, Jiayan, Jia, Pengjun, Yaqiong, Cao, Panpan, Liu, Yao, Tan, Yi, Y (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Effect of Zn addition on primary silicon morphology and B distribution in Si-Al alloy[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2014,25(4):1751-1756
[69]张欢, 谭毅, 施伟, 李佳艳.液流电池用PAN碳毡材料的改性[J],材料导报,2014,28(3):124-130,145
[70]Tan, Yi, Pang, Dayu, Jiang, Dachuan, Shi, Shuang, Li, Jiayan, Wen, Shutao, Qin, Shiqiang, JY (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, 2 Linggong Rd, Dalian 116023, Liaoning Provin, Peoples R China..New method for boron removal from silicon by electron beam injection[J],MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING,2014,18(1):42-45

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