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高端集成电路封装高速贴片技术及装备攻关

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Leading Scientist:梁红伟

Project Participants:liuyang,xiaxiaochuan,mayanhua,Ma Haoran,zhangkexiong

Supported by:其他课题

Sub-Class of Project:地市级

Status:在研

Supported by:大连职业技术学院

Nature of Project:纵向

Date of Project Approval:2024-10-08

Scheduled completion time:2025-09-30

Date of Project Initiation:2024-10-01

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