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高端集成电路封装高速贴片技术及装备攻关

Release Time:2024-12-30  Hits:

Leading Scientist: 梁红伟

Project Participants: 柳阳,夏晓川,马艳华,马浩然,张克雄

Project Source: 其他课题

Sub-Class of Project: 地市级

Status: 在研

Supported by: Dalian Vocational and Technical College

Nature of Project: 纵向

Date of Project Approval: 2024-10-08

Scheduled Completion Time: 2025-09-30

Date of Project Initiation: 2024-10-01

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