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刘晓英
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高级工程师
博士生导师
硕士生导师
- 性别：女
- 毕业院校：大连理工大学
- 学位：博士
- 所在单位：材料科学与工程学院
- 办公地点：知远楼材料学院B113房间
- 联系方式：0411-84708448
- 电子邮箱：xiaoyliu@dlut.edu.cn
访问量：
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[21] 刘晓英, 马海涛, 罗忠兵, 赵艳辉, 黄明亮, 王来.刘晓英；马海涛；罗忠兵； 赵艳辉； 黄明亮； 王来 Fe粉对Sn-3Ag-0.5Cu复合钎料组织及性能的影响[J],中国有色金属学报,,2012,22(4):1169-1172
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[22] Liu, Xiaoying, Huang, Mingliang, Wu, C. M. L., Wang, Lai, L (reprint author), Dalian Univ Technol, Dept Mat Engn, Liaoning, Peoples R China..Effect of Y2O3 particles on microstructure formation and shear properties of Sn-58Bi solder[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2010,21(10):1046-1054
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[23] Liu, Xiaoying, Huang, Mingliang, Zhao, Yanhui, Wu, C. M. L., Wang, Lai, L (reprint author), Dalian Univ Technol, Dept Mat Engn, Dalian 116024, Liaoning, Peoples R China..The adsorption of Ag3Sn nano-particles on Cu-Sn intermetallic compounds of Sn-3Ag-0.5Cu/Cu during [J],JOURNAL OF ALLOYS AND COMPOUNDS,2010,492(1-2):433-438
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[24] 黄明亮, 刘晓英.Electromigration of 300 μm diameter Sn-3.0Ag-0.5Cu lead-free bumps in flip chip package[A],2010,1132-1137
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[25] Ye, Song, Huang, Mingliang, Chen, Leida, Liu, Xiaoying.Electromigration of 300 mu m Diameter Sn-3.0Ag-0.5Cu Lead-Free Bumps in Flip Chip Package[A],2010,1132-1137
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[26] Liu, Xiaoying, Zhao, Yanhui, Huang, Mingliang, Wu, C. M. L., Wang, Lai.Liquid-state Interfacial Reactions between Sn-Ag-Cu-Fe Composite Solders and Cu Substrate[A],2009,611-+
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[27] 刘晓英, 马海涛, 王来, Liu, X.-Y..超细氧化物颗粒对Sn-58Bi钎料组织及性能影响[J],大连理工大学学报,2008,48(1):51-57
