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Sensitivity analysis of the surface integrity of monocrystalline silicon to grinding speed with same grain depth-of-cut

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Date of Publication:2022-10-08

Journal:Advances in Manufacturing

Affiliation of Author(s):机械工程学院

Volume:8

Issue:1,SI

Page Number:97-106

ISSN No.:2095-3127

Pre One:Simulation of CMP Process Based on Mixed Elastohydrodynamic Lubrication Model with

Next One:Residual Stress Distribution in Silicon Wafers Machined by Rotational Grinding
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