Release Time:2023-01-19 Hits:
Date of Publication: 2022-10-08
Journal: Advances in Manufacturing
Institution: 机械工程学院
Volume: 8
Issue: 1,SI
Page Number: 97-106
ISSN: 2095-3127
Prev One:Simulation of CMP Process Based on Mixed Elastohydrodynamic Lubrication Model with
Next One:Residual Stress Distribution in Silicon Wafers Machined by Rotational Grinding