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Residual Stress Distribution in Silicon Wafers Machined by Rotational Grinding

Release Time:2023-01-19  Hits:

Date of Publication: 2022-10-08

Journal: JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING TRANSACTIONS OF THE ASME

Institution: 机械工程学院

Volume: 139

Issue: 8

ISSN: 1087-1357

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