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Analytical Elastic Plastic Cutting Model for Predicting Grain Depth-of-Cut in Ultrafine Grinding of Silicon Wafer

Release Time:2023-01-19  Hits:

Date of Publication: 2022-10-04

Journal: JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING TRANSACTIONS OF THE ASME

Volume: 140

Issue: 12

ISSN: 1087-1357

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