Microscopic stress analysis of nanoscratch induced sub-surface defects in a single-crystal silicon wafer
Release Time:2024-06-13 Hits:
Indexed by: Journal Papers
Document Code: 369626
Date of Publication: 2023-07-18
Journal: PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY
Volume: 82
Page Number: 290-303
ISSN: 0141-6359
Key Words: CUTTING BEHAVIOR; DAMAGE; DEFORMATION; MATERIAL REMOVAL; MECHANISMS; MODEL; PREDICTION