Dislocation slip mechanism and prediction method during the ultra-precision grinding process of monocrystalline silicon
Release Time:2024-06-13 Hits:
Indexed by: Journal Papers
Document Code: 391326
Date of Publication: 2024-07-29
Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
Volume: 177
ISSN: 1369-8001
Key Words: ANISOTROPY; DAMAGE; DEFORMATION; LOAD; SINGLE-CRYSTAL SILICON