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Dislocation slip mechanism and prediction method during the ultra-precision grinding process of monocrystalline silicon

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Date of Publication:2024-05-22

Journal:Materials Science in Semiconductor Processing

Volume:177

ISSN No.:1369-8001

Key Words:Atomistics; Dislocation slip; Forecasting; Grinding (machining); Grinding process; Initiation mechanism; Molecular dynamic models; Monocrystalline silicon; Prediction methods; Shear stress; Single-grains; Single grain scratch; Slip-mechanism; Ultraprecision grinding

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