Dislocation slip mechanism and prediction method during the ultra-precision grinding process of monocrystalline silicon
Release Time:2024-06-13 Hits:
Date of Publication: 2024-05-22
Journal: Materials Science in Semiconductor Processing
Volume: 177
ISSN: 1369-8001
Key Words: Atomistics; Dislocation slip; Forecasting; Grinding (machining); Grinding process; Initiation mechanism; Molecular dynamic models; Monocrystalline silicon; Prediction methods; Shear stress; Single-grains; Single grain scratch; Slip-mechanism; Ultraprecision grinding