A quantitative study of removal mechanism of copper polishing based on a single pad-asperity polishing test
Release Time:2024-09-03 Hits:
Indexed by: Journal Papers
Document Code: 361833
Date of Publication: 2023-02-01
Journal: INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES
Volume: 239
ISSN: 0020-7403
Key Words: CONTACT; CU CMP; DEFORMATION; MODEL; NANOINDENTATION; PASSIVATION; SILICON; SLURRY; SPECTROSCOPY; SURFACE