0mjPSMEzg5CsWHwXB13eXxTHRgmNrnW2F3bWDF0dS6e6EG8TfaZzyGiAPsuk
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A quantitative study of removal mechanism of copper polishing based on a single pad-asperity polishing test

Release Time:2024-09-03  Hits:

Date of Publication: 2024-07-02

Journal: International Journal of Mechanical Sciences

Volume: 239

ISSN: 0020-7403

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