location: Current position: Home >> Scientific Research >> Paper Publications

多层光纤线包结构稳定性高效计算模型与分析

Hits:

Date of Publication:2024-09-02

Journal:Acta Armamentarii

Volume:45

Issue:8

Page Number:2554-2563

ISSN No.:1000-1093

Pre One:A quantitative study of removal mechanism of copper polishing based on a single pad-asperity polishing test

Next One:Study of Prefabricated Crack Propagation on Monocrystalline Silicon Surfaces for Grinding Damage Analysis