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Indexed by:期刊论文

Date of Publication:2015-01-01

Journal:PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY

Included Journals:SCIE、EI

Volume:39

Page Number:161-166

ISSN No.:0141-6359

Key Words:Electrochemistry; Chemical polishing; Roughness; Patterned surface

Abstract:Stress free polishing method is preferred for a damage free surface of copper with ultra-flatness and ultra-smoothness. Such a surface offers a perfect substrate for integrated circuits and micro-electromechanical systems fabrication. A new polishing method, called electrogenerated chemical polishing (EGCP), is proposed based on the principle of the scanning electrochemical microscope (SECM) and the diffusion controlled chemical reaction. Roughness of a Cu surface is reduced from 100.5 nm to 3.6 nm by the proposed method. To demonstrate the planarization capability of this new method, a patterned Cu surface with an array of micro-columns is planarized with a peak-valley (PV) value from 4.7 mu m to 0.059 mu m. (C) 2014 Elsevier Inc. All rights reserved.