Release Time:2019-03-09  Hits:

Indexed by: Journal Article

Date of Publication: 2015-01-01

Journal: PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY

Included Journals: EI、SCIE

Volume: 39

Page Number: 161-166

ISSN: 0141-6359

Key Words: Electrochemistry; Chemical polishing; Roughness; Patterned surface

Abstract: Stress free polishing method is preferred for a damage free surface of copper with ultra-flatness and ultra-smoothness. Such a surface offers a perfect substrate for integrated circuits and micro-electromechanical systems fabrication. A new polishing method, called electrogenerated chemical polishing (EGCP), is proposed based on the principle of the scanning electrochemical microscope (SECM) and the diffusion controlled chemical reaction. Roughness of a Cu surface is reduced from 100.5 nm to 3.6 nm by the proposed method. To demonstrate the planarization capability of this new method, a patterned Cu surface with an array of micro-columns is planarized with a peak-valley (PV) value from 4.7 mu m to 0.059 mu m. (C) 2014 Elsevier Inc. All rights reserved.