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一种含有多孔结构的CMP抛光垫修整器

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First Author:Renke Kang

Disigner of the Invention:Dong Zhigang,段佳冬,Zhou Ping,zhuxianglong

Affilication of Author(s):机械工程学院

Application Number:CN106041741A

Authorization number:CN201610451507.8

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