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一种树脂基复合材料的全面残余应力低温检测法

Release Time:2022-10-19  Hits:

First Author: Xin Liu

Disigner of the Invention: Wu Zhanjun,何辉永,单一男,许乔奇

Institution: 运载工程与力学学部

Application Number: ZL 201610210393.8

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