点击次数：

发表时间：2016-01-01

发表刊物：金刚石与磨料磨具工程

所属单位：机械工程学院

期号：3

页面范围：1-5,10

ISSN号：1006-852X

摘要：In order to study the damage of monocrystalline silicon, it is ground using a diamond grinding block at different normal forces and velocities. The grain size of resin bond diamond grinding block is 38 to 45 ��m. The surface roughness value Ra, subsurface damage depth dsd and material removal rate MMR of monocrystalline silicon are measured to study the effect of grinding velocity and pressure on material removal quality. Results show that the material removal rate of monocrystalline silicon firstly increases and then decreases with the increase of the grinding velocity, whereas the depth of subsurface damage decreases monotonically. The change of the subsurface damage depth is not obvious as normal force increases. When the normal force is 5 N, Ra decreases obviously with the increasing grinding speed. However, when the normal force is 10 N, Ra tends to be stable. ? 2016, Diamond & Abrasives Engineering Editorial Office. All right reserved.

备注：新增回溯数据