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发表时间：2016-01-01

发表刊物：人工晶体学报

期号：5

页面范围：1317-1322

ISSN号：1000-985X

摘要：The material removal rate, surface roughness and self-sharpening ability induced by diamond lapping plates with different bonds of vitrified, resin and vitrified-resin composite in sapphire wafer lapping were investigated first and the best bond of diamond lapping plate was proposed. Based on the result, the material removal rate, surface roughness, surface/subsurface damage and material removal mechanism of sapphire substrates ground by diamond lapping plates with different grain sizes of W40, W20, W7 and W2.5 were further studied. A new high efficiency and low damage lapping process of sapphire substrates was proposed by stages using W40, W7 and W2.5 diamond lapping plate, respectively. The results show that the diamond lapping plate with vitrified-resin composite bond exhibit better grinding performance than another two diamond lapping plates with vitrified and resin bonds. As the decreased in grain size of the diamond lapping plate, the removal mode of ductile regime exhibited more than brittle fracture and the MRR, surface roughness and subsurface damage depth of the ground sapphire substrate obviously decreases. ? 2016, Chinese Ceramic Society. All right reserved.

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