大连理工大学主页平台管理系统高尚--中文主页-- Effects of taping on grinding quality of silicon wafers in backgrinding

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Effects of taping on grinding quality of silicon wafers in backgrinding

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发表时间：2022-10-02
发表刊物：FRONTIERS OF MECHANICAL ENGINEERING
所属单位：机械工程学院
文献类型：J
卷号：16
期号：3
页面范围：559-569
ISSN号：2095-0233
关键字："taping; silicon wafer; backgrinding; subsurface damage; surface roughness"

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