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一种微胶囊自愈合材料损伤和愈合机理的数值仿真方法

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First Author:yanglei

Disigner of the Invention:Wu Zhanjun,suntao,高东岳,申薛靖,李志伟,龚磊

Affilication of Author(s):运载工程与力学学部

Application Number:CN108038329A

Authorization number:CN201711420560.2

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