Current position: Home >> Scientific Research >> Patents

一种微胶囊自愈合材料损伤和愈合机理的数值仿真方法

Release Time:2022-10-19  Hits:

First Author: 杨雷

Disigner of the Invention: Wu Zhanjun,孙涛,高东岳,申薛靖,李志伟,龚磊

Institution: 运载工程与力学学部

Application Number: CN108038329A

Authorization Number: CN201711420560.2

Prev One:一种纤维增强复合材料在低温下热残余应力的数值计算方法

Next One:纳米级微胶囊、聚合物基自愈合复合材料及制备方法
Recommended Ph.D.Supervisor Recommended MA Supervisor Institutional Repository Personal Page

Address: No.2 Linggong Road, Ganjingzi District, Dalian City, Liaoning Province, P.R.C., 116024

Click:Times MOBILE Version
The Founding Time : ..
The Last Update Time : ..

Mobile phone sweep