Release Time:2022-10-19 Hits:
First Author: 杨雷
Disigner of the Invention: Wu Zhanjun,徐浩,刘科海,高东岳,李志伟
Institution: 运载工程与力学学部
Application Number: CN108090963A
Authorization Number: CN201711418553.9
Prev One:纳米级微胶囊、聚合物基自愈合复合材料及制备方法
Next One:一种微胶囊自愈合材料损伤和愈合机理的数值仿真方法