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论文类型：会议论文

发表时间：2016-08-16

收录刊物：Scopus、SCIE、CPCI-S、EI

页面范围：608-611

关键字：Soldering; Synchrotron radiation; Intermetallic compounds; Thermal conductivity; Finite element analysis

摘要：Synchrotron radiation x-ray imaging technique was applied for in-situ observation of interfacial bubbles in Cu/molten Sn-3.5Ag/Cu joint undergoing thermomigration. The heating plate temperature was maintained at 350 degrees C and reflow time of 1 h was considered. Interfacial bubbles at hot side, favoured by wetting transition for growth, increase the effective thermal gradient in the solder medium. The interfacial voids lower the resistance of Sn-based solder joints to thermomigration. The numerical model for effective thermal conductivity and heat transfer in the inhomogeneous medium was implemented using finite element method.