- [1]Ma, H. R..Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Chen, J.,Zhao, N.,Wang, Y. P.,Li, X. G.,Ma, H. T.,Dong, C..Analysis and control of Cu6Sn5 preferred nucleation on single crystal (001)Cu[J],MATERIALS LETTERS,2020,265
- [2]Qiao, Y. Y..Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Wu, C. M. L.,Wang, Y. P.,Ma, H. T.,Zhao, N.,Liu, C. Y..Dramatic morphological reservation of prism-type Cu6Sn5 formed on single crystal Cu substrates under temperature gradient[J],MATERIALS TODAY COMMUNICATIONS,2020,23
- [3]Gao, Zhaoqing.Ma, HT; Wang, YP (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Sun, Hao,Dong, Chong,Ma, Haitao,Wang, Yunpeng,Cao, Jinwei,Muzammal , Hussain Muhammad,Wang, Chen.Ultrasound assisted large scale fabrication of superhydrophilic anodized SnOx films with highly uniformed nanoporous arrays[J],MATERIALS CHEMISTRY AND PHYSICS,2020,242
- [4]Zhu, Zhidan.Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China.; Ma, HR (reprint author), Dalian Univ Technol, Sch Microelect, Dalian 116024, Peoples R China..Li, Xiaogan,Ma, Haitao,Wang, Yunpeng,Shang, Shengyan,Ma, Haoran.Effect of polycrystalline Cu microstructures on IMC growth behavior at Sn/Cu soldering interface[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2019,30(17):15964-15971
- [5]Shang, Shengyan.Ma, HT; Wang, YP (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Yao, Jinye,Ma, Haitao,Wang, Yunpeng,Kunwar, Anil.Geometrical effects on growth kinetics of interfacial intermetallic compounds in Sn/Cu joints reflowed with Cu nanoparticles doped flux[J],THIN SOLID FILMS,2019,669:198-207
- [6]Zhong, Y..Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Ma, H. T.,Zhao, N.,Dong, W.,Wang, Y. P..In situ study on the effect of Cu5Zn8 intermetallic layer on the Cu-Ni cross interaction in Cu/Sn-9Zn/Ni interconnect under temperature gradient[J],MATERIALS CHEMISTRY AND PHYSICS,2018,216:130-135
- [7]Shang, Shengyan.Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Zhao, Ning,Huang, Mingliang,Ma, Haitao,Yao, Jinye,Wang, Yunpeng,Kunwar, Anil.All-round suppression of Cu6Sn5 growth in Sn/Cu joints by utilizing TiO2 nanoparticles[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(18,SI):15966-15972
- [8]Shang, Shengyan.Ma, HT; Wang, YP (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Ma, Haitao,Wang, Yunpeng,Kunwar, Anil,Wang, Yanfeng,Qi, Xiao.Synthesis of Cu@Ag core-shell nanoparticles for characterization of thermal stability and electric resistivity[J],APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING,2018,124(7)
- [9]Ma, H. R..Ma, HT; Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Zhao, N.,Jiang, C. R.,Wang, Y. P.,Ma, H. T.,Kunwar, A.,Shang, S. Y..Evolution behavior and growth kinetics of intermetallic compounds at Sn/Cu interface during multiple reflows[J],INTERMETALLICS,2018,96:1-12
- [10]Ma, Haoran.Ma, HT; Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Zhao, Ning,Song, Xueguan,Raback, Peter,Ma, Haitao,Chen, Jun,Qu, Lin,Wang, Yunpeng,Kunwar, Anil.Study of electrochemical migration based transport kinetics of metal ions in for Sn-9Zn alloy[J],MICROELECTRONICS RELIABILITY,2018,83:198-205