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论文类型：期刊论文

发表时间：2018-09-01

发表刊物：JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

收录刊物：SCIE、CPCI-S

卷号：29

期号：18,SI

页面范围：15966-15972

ISSN号：0957-4522

摘要：Both and Cu nanoparticles, when added at the interface of the Sn/Cu joints during reflow soldering at 250 A degrees C for 10, 60, 120 s and subsequent air cooling, are observed to reduce the growth of whiskers. Though both reinforcments reduce the vertical growth of intermetallic compound (IMC), only could suppress the lateral growth of the compound. The solder saturation level with Cu at different reflow duration can influence final dimensions as well as morphology of IMC and occurrence of screw dislocation. The addition of , by intervening the mechanism of ostwald ripening during reflow can be utilized to enhance the solder-IMC bonding at interface.