王云鹏

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教授

博士生导师

硕士生导师

性别：男

毕业院校：东京大学

学位：博士

所在单位：材料科学与工程学院

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Ma, H. R..Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Chen, J.,Zhao, N.,Wang, Y. P.,Li, X. G.,Ma, H. T.,Dong, C..Analysis and control of Cu6Sn5 preferred nucleation on single crystal (001)Cu[J],MATERIALS LETTERS,2020,265
Qiao, Y. Y..Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Wu, C. M. L.,Wang, Y. P.,Ma, H. T.,Zhao, N.,Liu, C. Y..Dramatic morphological reservation of prism-type Cu6Sn5 formed on single crystal Cu substrates under temperature gradient[J],MATERIALS TODAY COMMUNICATIONS,2020,23
Gao, Zhaoqing.Ma, HT; Wang, YP (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Sun, Hao,Dong, Chong,Ma, Haitao,Wang, Yunpeng,Cao, Jinwei,Muzammal , Hussain Muhammad,Wang, Chen.Ultrasound assisted large scale fabrication of superhydrophilic anodized SnOx films with highly uniformed nanoporous arrays[J],MATERIALS CHEMISTRY AND PHYSICS,2020,242
Zhu, Zhidan.Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China.; Ma, HR (reprint author), Dalian Univ Technol, Sch Microelect, Dalian 116024, Peoples R China..Li, Xiaogan,Ma, Haitao,Wang, Yunpeng,Shang, Shengyan,Ma, Haoran.Effect of polycrystalline Cu microstructures on IMC growth behavior at Sn/Cu soldering interface[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2019,30(17):15964-15971
Shang, Shengyan.Ma, HT; Wang, YP (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Yao, Jinye,Ma, Haitao,Wang, Yunpeng,Kunwar, Anil.Geometrical effects on growth kinetics of interfacial intermetallic compounds in Sn/Cu joints reflowed with Cu nanoparticles doped flux[J],THIN SOLID FILMS,2019,669:198-207
Zhong, Y..Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Ma, H. T.,Zhao, N.,Dong, W.,Wang, Y. P..In situ study on the effect of Cu5Zn8 intermetallic layer on the Cu-Ni cross interaction in Cu/Sn-9Zn/Ni interconnect under temperature gradient[J],MATERIALS CHEMISTRY AND PHYSICS,2018,216:130-135

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