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论文类型：期刊论文

发表时间：2018-05-01

发表刊物：INTERMETALLICS

收录刊物：EI、SCIE

卷号：96

页面范围：1-12

ISSN号：0966-9795

关键字：Intermetallics; In situ; Joining; Interfaces; Finite-element modeling

摘要：Evolution behavior and growth kinetics of Sn/Cu interfacial intermetallic compound (IMC) during multiple reflows were investigated. Scanning electron microscope (SEM) and shanghai synchrotron radiation facility (SSRF) images have shown that, scallop Cu6Sn5, formed at interface during the heating stage of a reflow, converted to facet type during subsequent cooling, and transformed back to the scalloped grains with larger size during the next re-heating stage. Furthermore, the value of IMC growth time exponent n during soldering gradually changed from 0.405 to 0.485 while nearly kept 1 during cooling and heating with reflow times. In addition, n was 0.613 for the overall multiple reflow process.