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论文类型：会议论文

发表时间：2017-01-01

收录刊物：SCIE、EI、CPCI-S、Scopus

页面范围：1502-1507

关键字：Reliability; Phase field method; Quantitative polynomial free energy; Void; Pb-free solder

摘要：As the electronic packaging and fabrication industries for solar PV cells assembly or panels are making endeavours in using Pb-free solder joints, the reliability of these joints can be taken as an important research topic. Among several aspects, the control of void formation, growth and evolution in lead-free Sn-based solders can be achieved if the underlying mechanism for such phenomena can be modeled. This study employs a quantitative polynomial free energy based phase field method to model the motion and evolution of void in Sn material under thermal gradient. The effects of imposed temperature gradient to the overall migration rate and profile of the void has been assessed in the finite element model.