Formation mechanism and kinetic analysis of the morphology of Cu6Sn5 in the spherical solder joints at the Sn/Cu liquid–solid interface during soldering cooling stage
点击次数：
论文类型：期刊论文
发表时间：2016-01-01
发表刊物：Journal of Material Science: Materials in Electronics
卷号：28
期号：1
页面范围：5398-5406