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论文类型：会议论文

发表时间：2018-01-01

收录刊物：CPCI-S

页面范围：135-140

关键字：Nanoparticles; Intermetallic compounds; Screw dislocation; Finite element method; Solder

摘要：With nanoparticles (NPs) for enhancement the reliability of solder joints and interconnections is a trending research arena. In this study, Cu NPs prepared by chemical reduction method, were doped into flux and disseminated to the pure Sn solder (initial diameter of 1.4 mm) and iterfaces during reflow at 250 degrees C for 30 s and 90 s. For the experiment, the solder corresponding to flux without NPs content was observed to have the bigger thickness of Cu6Sn5 layer, compare with the specimen treated with flux with nanoparticles. The presence of Cu NPs was observed to hinder the IMC growth. Upon cooling, the oxides formed by Cu NPs altered the screw-dislocation driven growth of prismatic IMCs and thus produced Cu6Sn5 rods with tapered ends. In the sector of microelectronic packaging materials design, the technique of doping the flux with Cu nanoparticles can be utilized to optimally tailor the interfacial IMC layer microstructure and the thickness.