白倩
个人信息Personal Information
副教授
博士生导师
硕士生导师
性别:女
毕业院校:伦敦帝国理工学院
学位:博士
所在单位:机械工程学院
学科:机械制造及其自动化. 材料加工工程
办公地点:知方楼5007
联系方式:13842856182
电子邮箱:baiqian@dlut.edu.cn
扫描关注
- [61]Huo, Yuanming, Lin, Jianguo, Bai, Qian, Wang, Baoyu, Tang, Xuefeng, Ji, Hongchao, JG, Wang, BY (reprint author), Univ Sci & Technol Beijing, Sch Mech Engn, Beijing 100083, Peoples R China..Prediction of microstructure and ductile damage of a high-speed railway axle steel during cross...[J],JOURNAL OF MATERIALS PROCESSING TECHNOLOGY,2017,239:359-369
- [62]Zhang, Bi, Li, Yongtao, Bai, Qian, B (reprint author), Dalian Univ Technol, Key Lab Precis & Nontradit Machining Technol, Minist Educ, Dalian 116024, Peoples R China., Zhang, Univ Connecticut, Dept Mech Engn, Storrs, CT 06269 USA..Defect Formation Mechanisms in Selective Laser Melting: A Review[J],CHINESE JOURNAL OF MECHANICAL ENGINEERING,2017,30(3):515-527
- [63]Bai, Qian, Mohamed Mohamed, Shi, Zhusheng, Lin, Jianguo, Trevor Dean.Application of a continuum damage mechanics (CDM)-based model for predicting formability of war...[J],INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2017,88(9-12):3437-3446
- [64]Feng, Heng, Bai, Qian, Dong, Xinghan, 白倩.A study of Residual Stress in Rolled Copper before and after Heat Treatment[A],2017,617-622
- [65]Wang, Yibo, Bai, Qian, Du, Wei, Zhang, Bi.Effect on Eddy Current Detection for Subsurface Defects in Titanium Alloys[A],2017,1445-1452
- [66]Fang Shuang, Shi, Zhusheng, Bai, Qian, Jiang, JiaYing, Wang, Shuyun, Lin, Jianguo.An investigation of direct powder forging of nickel superalloy FGH96[A],2016,716:793-799
- [67]Du, Wei, Bai, Qian, Zhang, Bi.A Novel Method for Additive/Subtractive Hybrid Manufacturing of Metallic Parts[A],2016,5:1018-1030
- [68]Huo, Yuanming, Bai, Qian, Wang, Baoyu, Lin, Jianguo, Zhou, Jing, JG (reprint author), Univ London Imperial Coll Sci Technol & Med, Dept Mech Engn, Exhibit Rd, London SW7 2AZ, England..A new application of unified constitutive equations for cross wedge rolling of a high-speed rai...[J],JOURNAL OF MATERIALS PROCESSING TECHNOLOGY,2015,223:274-283